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Title: | Performance of MWCNT-Reinforced SAC0307/Cu Solder Joint Under Multiple Reflow Cycles |
Authors: | Tikale, S. Prabhu, K.N. |
Issue Date: | 2018 |
Citation: | Transactions of the Indian Institute of Metals, 2018, Vol.71, 11, pp.2693-2698 |
Abstract: | The evolution of interfacial microstructure and its effect on shear strength under multiple reflow cycles for multi-walled carbon nanotubes (MWCNT)-reinforced Sn0.3Ag0.7Cu solder/copper joint was investigated. The melting characteristics, wettability and mechanical properties of the solder alloy were assessed. The addition of MWCNT in the range of 0.01 0.05 wt% improved the wettability, melting behaviour and mechanical strength of the SAC0307 solder alloy. The nanoparticles in small weight fraction (0.01 0.05 wt%) addition were more effective in retarding intermetallic compounds growth at the interface. Amongst all compositions studied, the SAC0307 0.05MWCNT nanocomposite showed significant improvement in the performance of SAC0307/Cu solder joint under multiple reflow condition. The nanoparticles reinforcement above 0.1 wt% of the solder alloy was ineffective in improving the solder performance due to increased clustering in the matrix. 2018, The Indian Institute of Metals - IIM. |
URI: | http://idr.nitk.ac.in/jspui/handle/123456789/13000 |
Appears in Collections: | 1. Journal Articles |
Files in This Item:
File | Description | Size | Format | |
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9 Performance of MWCNT.pdf | 1.48 MB | Adobe PDF | View/Open |
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