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dc.contributor.authorTikale, S.-
dc.contributor.authorPrabhu, K.N.-
dc.date.accessioned2020-03-31T08:42:39Z-
dc.date.available2020-03-31T08:42:39Z-
dc.date.issued2018-
dc.identifier.citationTransactions of the Indian Institute of Metals, 2018, Vol.71, 11, pp.2693-2698en_US
dc.identifier.urihttp://idr.nitk.ac.in/jspui/handle/123456789/13000-
dc.description.abstractThe evolution of interfacial microstructure and its effect on shear strength under multiple reflow cycles for multi-walled carbon nanotubes (MWCNT)-reinforced Sn0.3Ag0.7Cu solder/copper joint was investigated. The melting characteristics, wettability and mechanical properties of the solder alloy were assessed. The addition of MWCNT in the range of 0.01 0.05 wt% improved the wettability, melting behaviour and mechanical strength of the SAC0307 solder alloy. The nanoparticles in small weight fraction (0.01 0.05 wt%) addition were more effective in retarding intermetallic compounds growth at the interface. Amongst all compositions studied, the SAC0307 0.05MWCNT nanocomposite showed significant improvement in the performance of SAC0307/Cu solder joint under multiple reflow condition. The nanoparticles reinforcement above 0.1 wt% of the solder alloy was ineffective in improving the solder performance due to increased clustering in the matrix. 2018, The Indian Institute of Metals - IIM.en_US
dc.titlePerformance of MWCNT-Reinforced SAC0307/Cu Solder Joint Under Multiple Reflow Cyclesen_US
dc.typeArticleen_US
Appears in Collections:1. Journal Articles

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