Please use this identifier to cite or link to this item: https://idr.l4.nitk.ac.in/jspui/handle/123456789/13263
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dc.contributor.authorAnkit, K.
dc.contributor.authorVarade, A.
dc.contributor.authorReddy, N.
dc.contributor.authorDhan, S.
dc.contributor.authorChellamalai, M.
dc.contributor.authorKrishna, P.
dc.contributor.authorBalashanmugam, N.
dc.date.accessioned2020-03-31T08:45:29Z-
dc.date.available2020-03-31T08:45:29Z-
dc.date.issued2017
dc.identifier.citationDiamond and Related Materials, 2017, Vol.80, , pp.108-112en_US
dc.identifier.urihttp://idr.nitk.ac.in/jspui/handle/123456789/13263-
dc.description.abstractDiamond-like carbon (DLC) coatings have been deposited on Silicon wafers using a Radio Frequency based Plasma Enhanced Chemical Vapor Deposition (RF-PECVD) at room temperature. Experiments were carried out using a flow rate of 100 sccm and 300 sccm of acetylene (C2H2) gas and the bias voltage was varied from 300 to 450 V for DLC deposition. Scanning electron microscope (SEM) and transmission electron microscope (TEM) has been used to study the structure and morphology of the DLC coating. TEM results of DLC coatings deposited at 100 sccm C2H2 flow suggest that some crystalline features of diamond are present in the disordered matrix of DLC. Mechanical properties of DLC coatings were studied using a nanoindenter. The results indicate that the hardest DLC film is obtained at 100 sccm flow rate of C2H2 deposited at 450 V bias voltage of about 32.25 GPa. The results also indicate that the lowest coefficient of friction (COF) of about 0.04 in DLC film is obtained at 300 sccm flow rate of C2H2 deposited at 400 V bias voltage. COF is found to be lower in high C2H2 flow rate, wherever relatively softer DLC was deposited. 2017 Elsevier B.V.en_US
dc.titleSynthesis of high hardness, low COF diamond-like carbon using RF-PECVD at room temperature and evaluating its structure using electron microscopyen_US
dc.typeArticleen_US
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