Please use this identifier to cite or link to this item: https://idr.l4.nitk.ac.in/jspui/handle/123456789/11968
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dc.contributor.authorNyamannavar, S.-
dc.contributor.authorPrabhu, K.N.-
dc.date.accessioned2020-03-31T08:36:01Z-
dc.date.available2020-03-31T08:36:01Z-
dc.date.issued2008-
dc.identifier.citationTransactions of the Indian Institute of Metals, 2008, Vol.61, 4, pp.279-282en_US
dc.identifier.urihttp://idr.nitk.ac.in/jspui/handle/123456789/11968-
dc.description.abstractIn the present work an experimental set-up was designed to simulate the dip soldering conditions. The set-up was used to estimate heat flux transients at the solder/substrate interface during solidification of Sn 3.5Ag solder against copper substrate. The inverse heat conduction problem (IHCP) was solved in the substrate region for estimation of heat flux transients. A reasonably good agreement between measurements and model predictions was achieved validating the inverse model. The computer code developed in the present study could be used to assess the effect of process variables on contact heat flux at the solder/substrate interface.en_US
dc.titleHeat flux transients at the solder/substrate interface in dip solderingen_US
dc.typeArticleen_US
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