Please use this identifier to cite or link to this item: https://idr.l4.nitk.ac.in/jspui/handle/123456789/11177
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dc.contributor.authorNarendran, G.-
dc.contributor.authorGnanasekaran, N.-
dc.contributor.authorArumuga, Perumal, D.-
dc.date.accessioned2020-03-31T08:30:53Z-
dc.date.available2020-03-31T08:30:53Z-
dc.date.issued2019-
dc.identifier.citationHeat Transfer Engineering, 2019, Vol., , pp.-en_US
dc.identifier.urihttp://idr.nitk.ac.in/jspui/handle/123456789/11177-
dc.description.abstractThermal design consideration is highly essential for efficient heat dissipation in advanced microprocessors which are subjected to conjugate heat transfer under high heat flux with a minimal area for cooling. Generally, these multicore processors develop a localized high density heat flux referred to as hotspot. The effective use of microchannel in order to mitigate the hotspot is found in literature; however, the flow induced hotspot still exist due to maldistribution of flow inside the microchannel. Henceforth, the present study provides an experimental insight on laminar forced convection in a parallel microchannel heat sink accompanied with 1.2 mm thin copper heat spreader with a surface area of 30 mm2 to effectively migrate the maldistribution flow induced hot spot. The present experimental study provides a profound insight about the hotspot and migration of hotspot to safe zones; as a result, not only the performance of the multi core microprocessor is highly improved but also the reliability of neighboring components is well secured. 2019, 2019 Taylor & Francis Group, LLC.en_US
dc.titleExperimental Investigation on Heat Spreader Integrated Microchannel Using Graphene Oxide Nanofluiden_US
dc.typeArticleen_US
Appears in Collections:1. Journal Articles

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