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DC Field | Value | Language |
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dc.contributor.author | Narendran, G. | - |
dc.contributor.author | Gnanasekaran, N. | - |
dc.contributor.author | Arumuga, Perumal, D. | - |
dc.date.accessioned | 2020-03-31T08:30:53Z | - |
dc.date.available | 2020-03-31T08:30:53Z | - |
dc.date.issued | 2019 | - |
dc.identifier.citation | Heat Transfer Engineering, 2019, Vol., , pp.- | en_US |
dc.identifier.uri | http://idr.nitk.ac.in/jspui/handle/123456789/11177 | - |
dc.description.abstract | Thermal design consideration is highly essential for efficient heat dissipation in advanced microprocessors which are subjected to conjugate heat transfer under high heat flux with a minimal area for cooling. Generally, these multicore processors develop a localized high density heat flux referred to as hotspot. The effective use of microchannel in order to mitigate the hotspot is found in literature; however, the flow induced hotspot still exist due to maldistribution of flow inside the microchannel. Henceforth, the present study provides an experimental insight on laminar forced convection in a parallel microchannel heat sink accompanied with 1.2 mm thin copper heat spreader with a surface area of 30 mm2 to effectively migrate the maldistribution flow induced hot spot. The present experimental study provides a profound insight about the hotspot and migration of hotspot to safe zones; as a result, not only the performance of the multi core microprocessor is highly improved but also the reliability of neighboring components is well secured. 2019, 2019 Taylor & Francis Group, LLC. | en_US |
dc.title | Experimental Investigation on Heat Spreader Integrated Microchannel Using Graphene Oxide Nanofluid | en_US |
dc.type | Article | en_US |
Appears in Collections: | 1. Journal Articles |
Files in This Item:
File | Description | Size | Format | |
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6 Experimental Investigation on Heat.pdf | 3.59 MB | Adobe PDF | View/Open |
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